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? 2009-2012 microchip technology inc. ds22135c-page 1 mcp6l1/1r/2/4 features supply voltage: 2.7v to 6.0v rail-to-rail output input range includes ground available in sot-23-5 package gain bandwidth product: 2.8 mhz (typical) supply current: i q = 200 a/amplifier (typical) extended temperature range: -40c to +125c typical applications portable equipment photodiode amplifier analog filters data acquisition notebooks and pdas battery-powered systems design aids spice macro model filterlab ? software microchip advanced part selector (maps) analog demonstration and evaluation boards application notes typical application description the microchip technology inc. mcp6l1/1r/2/4 family of operational amplifiers (op amps) supports general- purpose applications. battery powered circuits benefit from their low quiescent current, a/d converters from their wide bandwidth and anti-aliasing filters from their low input bias current. this family has a 2.8 mhz gain bandwidth product (gbwp) with a low 200 a per amplifier quiescent current. these op amps operate on supply voltages between 2.7v and 6.0v, with rail-to-rail output swing. they are available in the extended temperature range. package types low-pass filter r 1 v in v out r 2 18.2 k ? 29.4 k ? mcp6l1 c 2 470 nf c 1 1.0 f mcp6l1 sot-23-5 mcp6l2 soic, msop v in + v ss v in - 1 2 3 5 4 v dd v out v ina + v ina - v ss 1 2 3 4 8 7 6 5 v outa v dd v outb v inb - v inb + mcp6l4 soic, tssop v ina + v ina - v dd 1 2 3 4 14 13 12 11 v outa v outd v ind - v ind + v ss v inb + 5 10 v inc + MCP6L1R sot-23-5 v in + v dd v in - 1 2 3 5 4 v ss v out v inb - 6 9 v inc - v outb 7 8 v outc mcp6l1 soic, msop v in + v in - v ss 1 2 3 4 8 7 6 5 nc ncv dd v out nc 2.8 mhz, 200 a op amps downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 2 ? 2009-2012 microchip technology inc. notes: downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 3 mcp6l1/1r/2/4 1.0 electrical characteristics 1.1 absolute maximum ratings ? v dd Cv ss .......................................................................7.0v current at input pins .......................................... ..........2 ma analog inputs (v in +, v in -) ?? ........ v ss C 1.0v to v dd +1.0v all inputs and outputs ................... v ss C 0.3v to v dd +0.3v difference input voltage ...................................... |v dd Cv ss | output short circuit current ................................ continuous current at output and supply pins ............................30 ma storage temperature ...................................-65c to +150c max. junction temperature ........................................ +150c esd protection on all pins (hbm, mm) ???????????????? 3 kv, 200v ? notice: stresses above those listed under absolute maxi- mum ratings may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those, or any other conditions above those indi- cated in the operational listings of this specification, is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. ?? see section 4.1.2 input voltage and current limits . 1.2 specifications table 1-1: dc electrical specifications electrical characteristics: unless otherwise indicated, t a = +25c, v dd = 5.0v, v ss = gnd, v cm = v ss , v out ? v dd /2, v l =v dd /2, and r l = 10 k ? to v l (refer to figure 1-1 ). parameters sym min ( note 1 ) typ max ( note 1 ) units conditions input offset input offset voltage v os -3 1 +3 mv input offset voltage drift ? v os / ? t a 2 . 5 v / c t a = -40c to+125c power supply rejection ratio psrr 90 db input current and impedance input bias current i b 1p a across temperature i b 2 0p a t a = +85c across temperature i b 5 0 0p a t a = +125c input offset current i os 1p a common-mode input impedance z cm 1 0 13 ||5 ? ||pf differential input impedance z diff 1 0 13 ||2 ? ||pf common-mode common-mode input voltage range v cmr -0.3 3.7 v common-mode rejection ratio cmrr 90 db v cm = -0.3v to 3.7v open-loop gain dc open-loop gain (large signal) a ol 1 0 5d b v out = 0.2v to 4.8v output maximum output voltage swing v ol 0.030 v g = +2, 0.5v input overdrive v oh 4.960 v g = +2, 0.5v input overdrive output short circuit current i sc 2 0m a power supply supply voltage v dd 2.7 6.0 v quiescent current per amplifier i q 70 200 330 a i o = 0 note 1: for design guidance only; not tested. downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 4 ? 2009-2012 microchip technology inc. 1.3 test circuit the circuit used for most dc and ac tests is shown in figure 1-1 . this circuit can independently set v cm and v out ; see equation 1-1 . note that v cm is not the cir- cuits common-mode voltage ((v p +v m )/2) and that v ost includes v os, plus the effects (on the input offset error, v ost ) of temperature, cmrr, psrr and a ol . equation 1-1: figure 1-1: ac and dc test circuit for most specifications. table 1-2: ac electrical specifications electrical characteristics: unless otherwise indicated, t a = 25c, v dd = +5.0v, v ss = gnd, v cm = v ss , v out ? v dd /2, v l = v dd /2, r l = 10 k ? to v l and c l = 60 pf (refer to figure 1-1 ). parameters sym min typ max units conditions ac response gain bandwidth product gbwp 2.8 mhz phase margin pm 50 (degree) g = +1 slew rate sr 2.3 v/s noise input noise voltage e ni 7 v p-p f = 0.1 hz to 10 hz input noise voltage density e ni 2 1n v / ? hz f = 10 khz input noise current density i ni 0 . 6f a / ? hz f = 1 khz table 1-3: temperature specifications electrical characteristics: unless otherwise indicated, all limits are specified for: v dd = +2.7v to +6.0v, v ss = gnd. parameters sym min typ max units conditions temperature ranges specified temperature range t a -40 +125 c operating temperature range t a -40 +125 c ( note 1 ) storage temperature range t a -65 +150 c thermal package resistances thermal resistance, 5l-sot-23 ? ja 2 2 0 . 7 c / w thermal resistance, 8l-msop ? ja 2 1 1 c / w thermal resistance, 8l-soic (150 mil) ? ja 149.5 c/w thermal resistance, 14l-soic ? ja 95.3 c/w thermal resistance, 14l-tssop ? ja 1 0 0 c / w note 1: operation must not cause t j to exceed maximum junction temperature specification (150c). g dm r f r g ? = v cm v p v dd 2 ? + ?? 2 ? = v out v dd 2 ? ?? v p v m ? ?? v ost 1 g dm + ?? ++ = where: g dm = differential-mode gain (v/v) v cm = op amps common-mode input voltage (v) v ost = op amps total input offset voltage (mv) v ost v in C v in + ? = v dd mcp6lx r g r f v out v m c b2 c l r l v l c b1 100 k ? 100 k ? r g r f v dd /2 v p 100 k ? 100 k ? 60 pf 10 k ? 1f 100 nf v in- v in+ c f 6.8 pf c f 6.8 pf downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 5 mcp6l1/1r/2/4 2.0 typical performance curves note: unless otherwise indicated, t a =+25c, v dd =5.0v, v ss = gnd, v cm =v ss , v out =v dd /2, v l =v dd /2, r l =10k ?? to v l and c l = 60 pf. figure 2-1: input offset voltage vs. common-mode input voltage at v dd =2.7v. figure 2-2: input offset voltage vs. common-mode input voltage at v dd =5.5v. figure 2-3: input offset voltage vs. ambient temperature. figure 2-4: input common-mode range voltage vs. ambient temperature. figure 2-5: cmrr, psrr vs. ambient temperature. figure 2-6: cmrr, psrr vs. frequency. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 common mode input voltage (v) input offset voltage (mv) representative part v dd = 2.7 v -40c +25c +85c +125 c -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 common mode input voltage (v) input offset voltage (v) representative part v dd = 5.5v -40c +25c +85c +125 c -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 ambient temperature (c) input offset voltage (mv) representative part v dd = 5.5v v dd = 2.7v -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 -50 -25 0 25 50 75 100 125 ambient temperature (c) common mode range; v cmrl C v ss (v) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 common mode range; v dd C v cmrh (v) v dd C v cmrh v cmrl C v ss one wafer lot 70 75 80 85 90 95 100 -50 -25 0 25 50 75 100 125 ambient temperature (c) cmrr, psrr (db) psrr (v cm = v ss ) cmrr (v cmrl to v cmrh ) 20 30 40 50 60 70 80 90 100 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 frequency (hz) cmrr, psrr (db) psrr+ cmrr psrrC 1 100 1k 10k 100k 10 downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 6 ? 2009-2012 microchip technology inc. note: unless otherwise indicated, t a =+25c, v dd =+5.0v, v ss = gnd, v cm =v ss , v out =v dd /2, v l =v dd /2, r l =10k ?? to v l and c l = 60 pf. figure 2-7: measured input current vs. input voltage (below v ss ). figure 2-8: open-loop gain, phase vs. frequency. figure 2-9: input noise voltage density vs. frequency. figure 2-10: the mcp6l1/1r/2/4 show no phase reversal. figure 2-11: quiescent current vs. power supply voltage. figure 2-12: output short circuit current vs. power supply voltage. 1.e-12 1.e-11 1.e-10 1.e-09 1.e-08 1.e-07 1.e-06 1.e-05 1.e-04 1.e-03 1.e-02 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 input voltage (v) input current magnitude (a) +125c +85c +25c -40c 10m 1m 100 10 1 100n 10n 1n 100p 10p 1p -20 0 20 40 60 80 100 120 1.e- 01 1.e+ 00 1.e+ 01 1.e+ 02 1.e+ 03 1.e+ 04 1.e+ 05 1.e+ 06 1.e+ 07 frequency (hz) open-loop gain (db) -210 -180 -150 -120 -90 -60 -30 0 open-loop phase () 0.1 1 10 1k 10k 100k 10m phase gain 100 1m 10 100 1,000 1.e-01 1.e+0 0 1.e+0 1 1.e+0 2 1.e+0 3 1.e+0 4 1.e+0 5 frequency (hz) input noise voltage density (nv/hz) 0.1 10 1 100 10k 1k 100k -1 0 1 2 3 4 5 6 0.e+00 5.e-06 1 .e-05 2.e-05 2 .e-05 3.e-0 5 time (5 s/div) input, output voltages (v) g = +2 v/v v in v out 0 50 100 150 200 250 300 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 power supply voltage (v) quiescent current per amplifier (a) -40 c +25 c +85 c +125 c -40 -30 -20 -10 0 10 20 30 40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 power supply voltage (v) short circuit current (ma) -40c +25c +85c +125c downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 7 mcp6l1/1r/2/4 note: unless otherwise indicated, t a =+25c, v dd =+5.0v, v ss = gnd, v cm =v ss , v out =v dd /2, v l =v dd /2, r l =10k ?? to v l and c l = 60 pf. figure 2-13: ratio of output voltage headroom to output current vs. output current. figure 2-14: small signal, non-inverting pulse response. figure 2-15: large signal, non-inverting pulse response. figure 2-16: slew rate vs. ambient temperature. figure 2-17: output voltage swing vs. frequency. 0 10 20 30 40 50 60 70 1.e-04 1.e-03 1.e-02 output current magnitude (a) ratio of output headroom to output current (mv/ma) 100 10m 1m v dd C v oh i out v ol C v ss -i out 2.42 2.44 2.46 2.48 2.50 2.52 2.54 2.56 2.58 0.e+0 0 1.e-0 6 2 .e- 06 3.e-06 4.e-06 5.e-0 6 6.e-0 6 7 .e- 06 8.e-06 9.e-06 1.e- 05 time (1 s/div) output voltage (20 mv/div) g = +1 v/v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 .e+00 1 .e- 0 6 2. e-0 6 3 .e- 0 6 4 .e- 06 5. e-0 6 6 .e- 0 6 7. e- 06 8 .e -0 6 9 .e- 06 1. e-0 5 time (1 s/div) output voltage (v) g = +1 v/v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 ambient temperature (c) slew rate (v/s) rising edge falling edge 0.1 1 10 1.e+04 1.e+05 1.e+06 frequency (hz) output voltage swing (v p-p ) v dd = 5.5v 10k 100k 1m v dd = 2.7v downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 8 ? 2009-2012 microchip technology inc. notes: downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 9 mcp6l1/1r/2/4 3.0 pin descriptions descriptions of the pins are listed in table 3-1 . table 3-1: pin function table 3.1 analog outputs the analog output pins (v out ) are low-impedance voltage sources. 3.2 analog inputs the non-inverting and inverting inputs (v in +, v in -, ) are high-impedance cmos inputs with low bias currents. 3.3 power supply pins the positive power supply (v dd ) is 2.7v to 6.0v higher than the negative power supply (v ss ). for normal operation, the other pins are between v ss and v dd . typically, these parts are used in a single (positive) supply configuration. in this case, v ss is connected to ground and v dd is connected to the supply. v dd will need bypass capacitors. mcp6l1 MCP6L1R mcp6l2 mcp6l4 symbol description sot-23-5 soic-8, msop-8 sot-23-5 soic-8, msop-8 soic-14, tssop-14 16111 v out , v outa output (op amp a) 42422 v in -, v ina - inverting input (op amp a) 33333 v in +, v ina + non-inverting input (op amp a) 57284 v dd positive power supply 5 5 v inb + non-inverting input (op amp b) 6 6 v inb - inverting input (op amp b) 7 7 v outb output (op amp b) 8 v outc output (op amp c) 9 v inc - inverting input (op amp c) 1 0 v inc + non-inverting input (op amp c) 24541 1 v ss negative power supply 1 2 v ind + non-inverting input (op amp d) 1 3 v ind - inverting input (op amp d) 1 4 v outd output (op amp d) 1, 5, 8 nc no internal connection downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 10 ? 2009-2012 microchip technology inc. notes: downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 11 mcp6l1/1r/2/4 4.0 application information the mcp6l1/1r/2/4 family of op amps is manufactured using microchips state of the art cmos process. they are unity gain stable and suitable for a wide range of general purpose applications. 4.1 inputs 4.1.1 phase reversal the mcp6l1/1r/2/4 op amps are designed to prevent phase inversion when the input pins exceed the supply voltages. figure 2-10 shows an input voltage exceeding both supplies without any phase reversal. 4.1.2 input voltage and current limits in order to prevent damage and/or improper operation of these amplifiers, the circuit they are in must limit the currents (and voltages) at the input pins (see section 1.1 absolute maximum ratings ? ). figure 4-1 shows the recommended approach to pro- tecting these inputs. the internal esd diodes prevent the input pins (v in + and v in -) from going too far below ground, and the resistors, r 1 and r 2 , limit the possible current drawn out of the input pins. diodes, d 1 and d 2 , prevent the input pins (v in + and v in -) from going too far above v dd , and dump any currents onto v dd . figure 4-1: protecting the analog inputs. a significant amount of current can flow out of the inputs (through the esd diodes) when the common- mode voltage (v cm ) is below ground (v ss ); see figure 2-7 . applications that are high-impedance may need to limit the usable voltage range. 4.1.3 normal operation the common-mode input voltage range (v cmr ) includes ground in single-supply systems (v ss ), but does not include v dd . this means that the amplifier input behaves linearly as long as the common-mode input voltage (v cm ) is kept within the v cmr limits (typically v ss C 0.3v to v dd C 1.3v at +25c). figure 4-3 shows a unity gain buffer. since v out is the same voltage as the inverting input, v out must be kept below v dd C 1.2v (typically) for correct operation. figure 4-2: unity gain buffer has a limited v out range. 4.2 rail-to-rail output the output voltage range of the mcp6l1/1r/2/4 op amps is v dd C 35 mv (minimum) and v ss +35mv (maximum) when r l =10k ? is connected to v dd /2 and v dd = 5.0v. refer to figure 2-13 for more information. 4.3 capacitive loads driving large capacitive loads can cause stability prob- lems for voltage feedback op amps. as the load capac- itance increases, the feedback loops phase margin decreases and the closed-loop bandwidth is reduced. this produces gain peaking in the frequency response, with overshoot and ringing in the step response. when driving large capacitive loads with these op amps (e.g., > 100 pf when g = +1), a small series resistor at the output (r iso in figure 4-3 ) improves the feedback loops stability by making the output load resistive at higher frequencies; the bandwidth will usually be decreased. figure 4-3: output resistor, r iso, stabilizes large capacitive loads. bench measurements are helpful in choosing r iso . adjust r iso so that a small signal step response (see figure 2-14 ) has reasonable overshoot (e.g., 4%). v 1 mcp6lx r 1 v dd d 1 r 1 > v ss C (minimum expected v 1 ) 2ma r 2 > v ss C (minimum expected v 2 ) 2ma v 2 r 2 d 2 r 3 v 1 mcp6lx v 2 r iso v out c l mcp6lx r f r g r n downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 12 ? 2009-2012 microchip technology inc. 4.4 supply bypass with this family of operational amplifiers, the power supply pin (v dd for single supply) should have a local bypass capacitor (i.e., 0.01 f to 0.1 f) within 2 mm for good high-frequency performance. it also needs a bulk capacitor (i.e., 1 f or larger) within 100 mm to provide large, slow currents. this bulk capacitor can be shared with other nearby analog parts. 4.5 unused op amps an unused op amp in a quad package (e.g., mcp6l4) should be configured, as shown in figure 4-4 . these circuits prevent the output from toggling and causing crosstalk. circuit a sets the op amp at its minimum noise gain. the resistor divider produces any desired refer- ence voltage within the output voltage range of the op amp; the op amp buffers that reference voltage. circuit b uses the minimum number of components and operates as a comparator, but it may draw more current. figure 4-4: unused op amps. 4.6 pcb surface leakage in applications where low input bias current is critical, the pcb (printed circuit board) surface leakage effects need to be considered. surface leakage is caused by humidity, dust or other contamination on the board. under low humidity conditions, a typical resistance between nearby traces is 10 12 ? . a 5v difference would cause 5 pa of current to flow; this is greater than this familys bias current at +25c (1 pa, typical). the easiest way to reduce surface leakage is to use a guard ring around sensitive pins (or traces). the guard ring is biased at the same voltage as the sensitive pin. figure 4-5 shows an example of this type of layout. figure 4-5: example guard ring layout. 1. inverting amplifiers ( figure 4-5 ) and transimpedance gain amplifiers (convert current to voltage, such as photo detectors). a) connect the guard ring to the non-inverting input pin (v in +); this biases the guard ring to the same reference voltage as the op amps input (e.g., v dd /2 or ground). b) connect the inverting pin (v in -) to the input with a wire that does not touch the pcb surface. 2. non-inverting gain and unity gain buffer. a) connect the guard ring to the inverting input pin (v in -); this biases the guard ring to the common-mode input voltage. b) connect the non-inverting pin (v in +) to the input with a wire that does not touch the pcb surface. 4.7 application circuits 4.7.1 active low-pass filter figure 4-6 shows a second-order butterworth filter, with a 10 hz cutoff frequency and a gain of +1 v/v, using a sallen key topology. microchips filterlab ? software designed the filter, then the capacitors were reduced in value (using the same program). figure 4-6: sallen key topology. figure 4-7 shows a filter with the same requirements, except the gain is -1 v/v, in a multiple feedback topology. it was designed in a similar fashion using filterlab. figure 4-7: multiple feedback topology. v dd v dd ? mcp6l4 (a) ? mcp6l4 (b) r 1 r 2 v dd v ref v ref v dd r 2 r 1 r 2 + ------------------ - ? = guard ring v in -v in + r 1 v in v out r 2 18.2 k ? 29.4 k ? mcp6l1 c 2 470 nf c 1 1.0 f r 1 v in v out r 3 54.9 k ? 25.5 k ? mcp6l1 c 2 820 nf c 1 220 nf v dd /2 r 2 25.5 k ? downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 13 mcp6l1/1r/2/4 5.0 design aids microchip provides the basic design aids needed for the mcp6l1/1r/2/4 family of op amps. 5.1 spice macro model the latest spice macro model for the mcp6l1/1r/2/4 op amp is available on the microchip web site at www.microchip.com . the model was written and tested in official orcad (cadence) owned pspice. for other simulators, translation may be required. the model covers a wide aspect of the op amps electrical specifications. not only does the model cover voltage, current and resistance of the op amp, but it also covers the temperature and noise effects on the behavior of the op amp. the model has not been verified outside of the specification range listed in the op amp data sheet. the model behaviors under these conditions cannot be ensured to match the actual op amp performance. moreover, the model is intended to be an initial design tool. bench testing is a very important part of any design and cannot be replaced with simulations. also, simulation results using this macro model need to be validated by comparing them to the data sheet specifications and characteristic curves. 5.2 filterlab ? software microchips filterlab software is an innovative software tool that simplifies analog active filter (using op amps) design. available at no cost from the microchip web site at www.microchip.com/filterlab , the filter-lab design tool provides full schematic diagrams of the filter circuit with component values. it also outputs the filter circuit in spice format, which can be used with the macro model to simulate actual filter performance. 5.3 microchip advanced part selector (maps) maps is a software tool that helps efficiently identify microchip devices that fit a particular design requirement. available at no cost from the microchip web site at www.microchip.com/maps , the maps is an overall selection tool for microchips product portfolio that includes analog, memory, mcus and dscs. using this tool, a customer can define a filter to sort features for a parametric search of devices and export side-by- side technical comparison reports. helpful links are also provided for data sheets, purchasing and sampling of microchip parts. 5.4 analog demonstration and evaluation boards microchip offers a broad spectrum of analog demon- stration and evaluation boards that are designed to help customers achieve faster time to market. for a complete listing of these boards and their correspond- ing users guides and technical information, visit the microchip web site at: www.microchip.com/analog tools . some boards that are especially useful are: mcp6xxx amplifier evaluation board 1 mcp6xxx amplifier evaluation board 2 mcp6xxx amplifier evaluation board 3 mcp6xxx amplifier evaluation board 4 active filter demo board kit p/n vsupev2: 5/6-pin sot-23 evaluation board p/n soic8ev: 8-pin soic/msop/tssop/dip evaluation board p/n soic14ev: 14-p in soic/tssop/dip evaluation board 5.5 application notes the following microchip application notes are available on the microchip web site at: www.microchip.com/appnotes and are recommended as supplemental reference resources. adn003: select the right operational amplifier for your filtering circuits , ds21821 an722: operational amplifier topologies and dc specifications , ds00722 an723: operational amplifier ac specifications and applications , ds00723 an884: driving capacitive loads with op amps , ds00884 an990: analog sensor conditioning circuits C an overview , ds00990 downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 14 ? 2009-2012 microchip technology inc. notes: downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 15 mcp6l1/1r/2/4 6.0 packaging information 6.1 package marking information 5-lead sot-23 ( mcp6l1, MCP6L1R ) example: device code mcp6l1 wcnn MCP6L1R wdnn note: applies to 5-lead sot-23. legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week 01) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 8-lead soic (150 mil)( mcp6l1, mcp6l2 ) example: 8-lead msop ( mcp6l1, mcp6l2 ) example: wc25 6l2e 14526 nnn mcp6l2e sn 1145 256 3 downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 16 ? 2009-2012 microchip technology inc. package marking information (continued) 14-lead tssop ( mcp6l4 ) example: 14-lead soic (150 mil) ( mcp6l4 ) example: mcp6l4 e/sl 1145256 yyww nnn xxxxxxxx 6l4e 1145 256 legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week 01) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 17 mcp6l1/1r/2/4 n b e e1 d 1 2 3 e e1 a a1 a2 c l l1 downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 18 ? 2009-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 19 mcp6l1/1r/2/4 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 20 ? 2009-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 21 mcp6l1/1r/2/4 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 22 ? 2009-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 23 mcp6l1/1r/2/4 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 24 ? 2009-2012 microchip technology inc. downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 25 mcp6l1/1r/2/4 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 26 ? 2009-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 27 mcp6l1/1r/2/4 downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 28 ? 2009-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 29 mcp6l1/1r/2/4 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 30 ? 2009-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 31 mcp6l1/1r/2/4 appendix a: revision history revision c (january 2012) the following is the list of modifications: 1. corrected cmrr value condition in tab l e 1 - 1 . 2. updated packages temperature values in table 1-3 . 3. corrected values in first paragraph of section 4.1.3 normal operation . revision b (september 2011) the following is the list of modifications: 1. updated section 3.0 pin descriptions . 2. updated the value for the current at output and supply pins parameter in section 1.1 absolute maximum ratings ? . 3. added section 5.1 spice macro model . revision a (march 2009) original release of this document. downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 32 ? 2009-2012 microchip technology inc. notes: downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 33 mcp6l1/1r/2/4 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . device: mcp6l1t: single op amp (tape and reel) (sot-23, msop, soic) MCP6L1Rt: single op amp (tape and reel) (sot-23) mcp6l2t: dual op amp (tape and reel) (soic, msop) mcp6l4t: quad op amp (tape and reel) (soic, tssop) temperature range: e = -40c to +125c package: ot = plastic small outline transistor (sot-23), 5-lead ms = plastic msop, 8-lead sn = plastic soic, (3.99 mm body), 8-lead sl = plastic soic (3.99 mm body), 14-lead st = plastic tssop (4.4mm body), 14-lead part no. x /xx package temperature range device examples: a) mcp6l1t-e/ot: tape and reel, extended temperature, 5ld sot-23 package b) mcp6l1t-e/ms: tape and reel, extended temperature, 8ld msop package. c) mcp6l1t-e/sn: tape and reel, extended temperature, 8ld soic package. a) MCP6L1Rt-e/ot:tape and reel, extended temperature, 5ld sot-23 package. a) mcp6l2t-e/ms: tape and reel, extended temperature, 8ld msop package. b) mcp6l2t-e/sn: tape and reel, extended temperature, 8ld soic package. a) mcp6l4t-e/sl: tape and reel, extended temperature, 14ld soic package. b) mcp6l4t-e/st: tape and reel, extended temperature, 14ld tssop package. downloaded from: http:///
mcp6l1/1r/2/4 ds22135c-page 34 ? 2009-2012 microchip technology inc. notes: downloaded from: http:///
? 2009-2012 microchip technology inc. ds22135c-page 35 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mxdev, mxlab, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, application maestro, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, total endurance, tsharc, uniwindriver, wiperlock and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2009-2012, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 978-1-61341-923-6 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchips code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the companys quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory an d analog products. in addition, microchips quality system for the design and manufacture of development systems is iso 9001:2000 certified. downloaded from: http:///
ds22135c-page 36 ? 2009-2012 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hangzhou tel: 86-571-2819-3187 fax: 86-571-2819-3189 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - osaka tel: 81-66-152-7160 fax: 81-66-152-9310 japan - yokohama tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-536-4818 fax: 886-7-330-9305 taiwan - taipei tel: 886-2-2500-6610 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 worldwide sales and service 11/29/11 downloaded from: http:///

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